ASUS ROG Phone 6D Ultimate 512GB 5G 165Hz MediaTek Dimensity 9000+ Grey Gaming Smartphone - A-Grade

£799.00 £665.83
Out of stock
Out of stock
SKU
ROG6DGREY512GBA-GRADE

Say hello to the ROG Phone 6D Ultimate, which features the unparalleled performance of the latest MediaTek Dimensity 9000+ processor. 

Say hello to the ROG Phone 6D Ultimate, which features the unparalleled performance of the latest MediaTek Dimensity 9000+ processor. Its super-efficient GameCool 6 thermal system and innovative AeroActive Portal raise your game into a different league, and the 165 Hz display will revolutionise your visual experience. The AirTrigger 6 system and the Armoury Crate app put you in total control, and the monster 6000 mAh1 battery lets you play for longer. Are you ready for awesome? Say yes to the ROG Phone 6D Ultimate, and prepare to change your gaming experience forever!

AWESOME POWER
Are you ready for the awesome MediaTek Dimensity 9000+? Its unparalleled performance is in a class of its own, with a clock speed boosted to a mind-blowing 3.2 GHz2, delivering up to 5% better CPU performance2 and 10% faster GPU performance2 than the previous Dimensity 9000. The ROG Phone 6D Ultimate also packs LPDDR5X RAM with 17% more memory bandwidth2 and up to 15% less latency2. Our world-famous Armoury Crate performance manager unlocks even more performance and tuning controls, giving the ROG Phone 6D Ultimate complete mastery of this amazing CPU’s power to vanquish any task!

AWESOME THERMALS
The advanced GameCool 6 cooling system in the ROG Phone 6D Ultimate pushes what’s possible to the limit. GameCool 6 incorporates three different approaches to cooling to improve stability for demanding games. Firstly, the Boron Nitride (BN) thermal compound on one side of the CPU reduces thermal throttling during short gaming sessions. Secondly, the enlarged vapor chamber, cooling fins and graphite sheets dissipate heat from the other side of the CPU more efficiently during mid-length gaming sessions. And finally, for long-term stability, the unique AeroActive Portal routes cooling airflow from the AeroActive Cooler 6 direct to the interior of ROG Phone 6D Ultimate, dissipating heat directly for industry-leading thermal efficiency.

AEROACTIVE PORTAL
ROG Phone 6D Ultimate delivers a giant leap in thermal technology. The AeroActive Portal is a precisely located air intake on the phone that opens automatically when the AeroActive Cooler is attached. The AeroActive Portal directs a continuous high-speed stream of cool air from the outside directly onto the vapor chamber’s cooling fins, efficiently dissipating the heat generated by the SoC. This unique thermal structure maximises both gaming performance and battery endurance simultaneously, and boosts thermal efficiency up to 20%4 when the AeroActive Portal is activated.

AEROACTIVE COOLER 6
The clip-on AeroActive Cooler 6 incorporates an AI-powered thermoelectric cooler, along with a powerful centrifugal fan in a wind-tunnel optimised design. Up to 40%5 of the high-speed airflow is directed into the AeroActive Portal, resulting in significantly improved thermal efficiency. Simultaneously, the thermoelectric cooling chip in the AeroActive Cooler rapidly cools down the surface temperature near the CPU by up to a stunning 25°C6. And what’s even more awesome is that the AeroActive Cooler 6 also adds four extra physical buttons to allow a genuine console-like control experience.

ALL-NEW 360° CPU COOLING TECHNOLOGY
For the first 15 minutes of gaming, the most important task is to ensure that the heat from the CPU is conducted to all thermal components for dissipation. The 3,300 milligrams of BN thermal compound transfers heat from the side of the CPU opposite the vapor chamber, dissipating the heat from chip much more efficiently, and ensuring maximum performance of the CPU and GPU for a stable gaming framerate. An explosion drawing of the 360<sup class='sign-deg' role='img' aria-label='degree'>°</sup> CPU cooling system including the CPU and the thermal compoundMediaTek Dimensity 9000+Main BoardBoron Nitride Thermal CompoundRF Board

More Information
EAN 4711081918066
Dimensions 163.3mm x 77.9mm x 8.9mm
Item Returns This item can be returned
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